Xilinx Field Programmable Gate Array – FPGA – part # XC3S1200E-4FT256C

Features

• Very low-cost, high-performance logic solution for high-volume, consumer-oriented applications

• Proven advanced 90-nanometer process technology

• Multi-voltage, multi-standard SelectIO™ interface pins

• Up to 376 I/O pins or 156 differential signal pairs

• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards

• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling

• 622+ Mb/s data transfer rate per I/O

• True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O

• Enhanced Double Data Rate (DDR) support

• DDR SDRAM support up to 333 Mb/s

• Abundant, flexible logic resources

• Densities up to 33,192 logic cells, including optional shift register or distributed RAM support

• Efficient wide multiplexers, wide logic

• Fast look-ahead carry logic

• Enhanced 18 x 18 multipliers with optional pipeline

• IEEE 1149.1/1532 JTAG programming/debug port

• Hierarchical SelectRAM™ memory architecture 

• Up to 648 Kbits of fast block RAM

• Up to 231 Kbits of efficient distributed RAM

• Up to eight Digital Clock Managers (DCMs)

• Clock skew elimination (delay locked loop)

• Frequency synthesis, multiplication, division

• High-resolution phase shifting

• Wide frequency range (5 MHz to over 300 MHz)

• Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing

• Configuration interface to industry-standard PROMs

• Low-cost, space-saving SPI serial Flash PROM

• x8 or x8/x16 parallel NOR Flash PROM

• Low-cost Xilinx® Platform Flash with JTAG

• Complete Xilinx ISE® and WebPACK™ software

• MicroBlaze™ and PicoBlaze embedded processor cores

• Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)

• Low-cost QFP and BGA packaging options

• Common footprints support easy density migration

• Pb-free packaging options

• XA Automotive version available

XLX:XC3S1200E-4FT256C

XC3S1200E-4FT256C